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Micronarc Alpine Meeting 2026
Dominique Valantin

Speaker Profile

Dominique Valantin

CEO, HYBRID SA

Switzerland

Small electronics – How to tackle miniaturization

Abstract

From Thick-Film Hybrids to 008004: 37 Years Pushing the Boundaries of Miniaturization

Since its founding in 1987, Hybrid SA has operated at the frontier of miniaturization in microelectronics assembly. Born from thick-film hybrid circuit technology — achieving 150µm line/space when standard FR4 could not — the company has continuously pushed the limits of what is manufacturable in small-to-medium series. This presentation traces that journey: from the origins of surface-mount technology to today's capabilities including 15µm wire bonding, 80µm-pitch solder flip chip, and 008004 component placement (100µm × 200µm). Beyond the technical milestones, it explores what it truly means to master processes at this scale in industrial production.

Bio

Dominique Valantin — CEO, Chairman of the Board & Sales Director, Hybrid SA

Dominique Valantin leads Hybrid SA, a Swiss microelectronics assembly specialist founded in 1989 and operating at the forefront of advanced packaging technologies. Following a management buyout in 2021, he has driven the company's strategic transformation, expanding its international reach across Europe and beyond while maintaining the rigorous quality standards that define the Swiss manufacturing tradition.
Under his leadership, Hybrid SA serves demanding sectors including space, medical, defence, watchmaking, and aeronautics, holding certifications including ISO 9001, ISO 13485, and J-STD-001 Space. The company supports programmes from TRL 4 through full-rate production, offering a rare combination of prototype agility and industrial-scale capability.